Offer Details:
Layers: 4 layers
Board thickness: 0.8mm
CAD software: CAM350 and Genesis 2000
Finished copper thickness: 1oz
Aspect ratio: 8:1
Surface finish: immersion tin
General capability:
Material: FR4, Mid-TG150, and high T-G170 with KB class-A or SY laminate
Board thickness: 0.2mm to 3.2mm
Finished copper thickness: max 4oz
Min trace width/spacing: 0.1/0.1mm (4/4 mil)
Min hole: 0.2mm (8 mil)
Surface finishing:
HAL (lead-free)
Immersion Ni/Au (Au: maximum 0.125um, Ni: maximum 5um)
Entek coating (OSP)
Immersion Ag
Immersion Sn (Sn:maximum 1.2um)
Peelable mask: peters SD2955
Kapon tape
RoHS compliant
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