Offer Details: We produce Thermoset Molding material & Molding Parts eg: BMC (Bulk Molding Compound),Polyester Molding Compound, Diallyl Phthalate Molding Compound (DAP),Phenolic(Bakelite powder), Melamine,Urea Molding Compound,Epoxy resin and Modified Polyester resin for Electronic casting or Encapsulation e.g.: Ballasts, Capacitor, Epoxy for prepreg (Carbon Fiber or Glass fiber application), Epoxy for lamination, Flooring epoxy,Thermoset Molding Facilities for above material. (Injection & Compreesion). |